Dimensity 8300 Ultra vs Snapdragon 8 Gen 3

Comparison of the technical parameters between the processors, with the MediaTek Dimensity 8300 Ultra on one side and the Qualcomm SM8650-AB Snapdragon 8 Gen 3 on the other side, and their comparative results with the benchmarks. The first, with a maximum frequency of 3.4GHz and 8 cores and 8 threads, is geared toward the smartphone market.

The second, which has eight cores and eight threads overall with a turbo frequency of 3.3 GHz, is utilized in the smartphone market. The lithography, number of transistors (if provided), quantity of cache memory, maximum RAM memory capacity, type of memory accepted, release date, maximum number of PCIe lanes, and results achieved in Geekbench and Cinebench are also compared in the following table.

Dimensity 8300 Ultra vs Snapdragon 8 Gen 3 Benchmarks

AnTuTu 10

Dimensity 8300 UltraSnapdragon 8 Gen 3
1,404,0572,089,914

GeekBench

Geekbench 4 single core5,3597,895
(Android)
Geekbench 4 multi-core
17,73723,949
(Android)
Geekbench 5 single core
1,1691,692
(Android)
Geekbench 5 multi-core
4,5856,278
(Android)
Geekbench 6 single core
1,4482,205
(Android)
Geekbench 6 multi-core
4,7397,114

Specifications

Full Technical Specifications Of Dimensity 8300 Ultra vs Snapdragon 8 Gen 3

CPU

ProcessorMediaTek Dimensity 8300 UltraQualcomm SM8650-AB Snapdragon 8 Gen 3
Market (main)SmartphoneSmartphone
ISAARMv9.0-A (64-bit)ARMv9.2-A (64-bit)
MicroarchitectureCortex-A715, Cortex-A510Cortex-X4, Cortex-A720,
Cortex-A520
Core nameCortex-A715, Cortex-A510Kryo
FamilyDimensitySnapdragon
Part number(s), S-SpecDimensity 8300 UltraSM8650-AB
Release date2023 Q42023 Q4
Lithography4 nm N4P4 nm N4P
Cores88
Threads88
Base frequency2.2 GHz2.3 GHz
Turbo frequency3.35 GHz3.3 GHz
Energy cores4x ARM Cortex-A510 @ 2.2 GHz2x Qualcomm Kryo Silver @ 2.3 Ghz
High performance cores1x ARM Cortex-A715 @ 3.35 GHz,
3x ARM Cortex-A715 @ 3.2 GHz
1x Qualcomm Kryo Prime @ 3.3 GHz,
5x Qualcomm Kryo Gold @ 3.2 Ghz
Cache memory8 MB12 MB
Max memory capacity16 GB24 GB
Memory typesLPDDR5X @ 4266.5 MHzLPDDR5x @ 4.8 GHz
Max # of memory channels44
TDP10 W9 W

Graphics

GPU integrated graphicsARM Mali-G615 MC6Qualcomm Adreno 750
GPU execution units66
GPU shading units961,536
GPU base clock600 MHz680 MHz
GPU boost clock600 MHz1000 MHz
GPU FP32 floating point916 GFLOPS5,548 GFLOPS
SocketSoCSoC
AI acceleratorMediaTek APU 780Qualcomm Hexagon NPU
AI computing operations per seconds45 TOPS
DSPQualcomm Hexagon
ISPMediaTek Imagiq 980Qualcomm Spectra

Multi Media

Max display resolutionWQHD+@120Hz, FHD+@180Hz4K@60Hz
Video decodingH.264, HEVC 4K@60fpsH.265, H.264, VP9 8K@60fps
Video encodingH.264, HEVC, VP-9, AV1H.265, H.264, VP9 8K@30fps, 4K@120fps
Max camera ISP320MP; 32+32+32MP200MP; 108MP; 64+36MP; 3x 36MP
Max video capture4K@60fps8K@30fps; 4K@120fps; 720p@960fps

Network

Cellular technologies5G/4G, CDMA2000, EVDO,
EDGE, GSM, CDMA
5G, HSPA, CDMA, EVDO, GSM, EDGE
GNSSGPS, BeiDou, Glonass,
Galileo, QZSS, NavIC
GLONASS, NavIC, Beidou,
GPS, QZSS, Galileo
ModemQualcomm Snapdragon X75 5G
5G download speedUp to 5.17 Gbit/sUp to 10 Gbit/s
5G upload speedUp to 3.5 Gbit/s
ConnectivityUFS 3.1USB-C, USB 3.1 Gen2
Wi-FiWi-Fi 6E a/b/g/n/ac/ax 2T2RWi-Fi 802.11 a/b/g/n/ac/ax/be Wi-Fi 7
BluetoothBluetooth 5.4Bluetooth 5.4, LE

Info

AnnouncedNovember 2023OCT 2023
ClassFlagshipFlagship
Model numberSM8650-AB
Official pageQualcomm Snapdragon 8 Gen 3

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